Dongguan ICCT Product Development

Gen 1.0

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Gen 2.0  Sintering Interconnection – Packaging Technology

Configurable Sintering Interconnection

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Gen. 2.0  Sintering Interconnection – Packaging Technology

-- Soldering point 200um x 400um.  I/O ：20-500 (single layer)

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Gen. 2.0  Sintering Interconnection – Packaging Technology

Similar to QFN encapsulation calculations – IC Packaging Process Flow

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Gen. 2.0  QFN  -  Key Advantages

 

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Gen. 2.5 -  3D printing + Laser Routing

 Rapid Packaging Applications

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3D Printing – with micro Etch (Patent Pending 2020)

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3D Print – with Laser cut (Patent Pending 2020)

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Printing Metallization/Laser Routing for Our Products

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Applications

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