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IC-Carrier Technologies 

2023 China High Tech Fair - Shenzhen

2018 Dongguan News ICCT

 

icct 2

 

3dic

IC Carrier Technologies was established in 2017. In ICCT, we focus on semiconductor device encapsulation, also known as integrated circuit packaging. Additionally, we are performing innovative activities to enhance further and improve our products.

In 2021, IC Carrier Technologies set up an IC Design and Packaging Centre in Suzhou SIP under the umbrella of A*Star SIP Partner Centre. We are also recipient of an A*Star SIP Grant to develop innovative technologies and products for the Semiconductor Industry.

INNO IC Design and Services Pte Ltd was set up in Oct 2024 to spearhead our core IC Design in Logic, LED display and Smart House applications

Gen 1: Dongguan ICCT technology 2018 (spin-off)

Gen 2: To transfer this technology to Suzhou ICCT (3D print & patents filing)

Gen 3: To R&D on wafer-level CSP, RDL, and Bumping.

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